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black epoxy removal from bga pads

2 Beiträge0 Aufrufevor 1 Monaten
vor 1 Monaten
#1

hi all.looking for some advice on best practice for removal/cleaning when after i remove ic on iphone and it has underfill covering the whole bga area and remaining solder balls on logic board .thank you


Importiert aus apple-forum.de

vor 1 Monaten
#2

Hi and welcome …

for me the best way is to use the soldering iron. Flux .. a lot of flux and then with the iron flying over the pads …

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