hi all.looking for some advice on best practice for removal/cleaning when after i remove ic on iphone and it has underfill covering the whole bga area and remaining solder balls on logic board .thank you
Importiert aus apple-forum.de
hi all.looking for some advice on best practice for removal/cleaning when after i remove ic on iphone and it has underfill covering the whole bga area and remaining solder balls on logic board .thank you
Importiert aus apple-forum.de
Hi and welcome …
for me the best way is to use the soldering iron. Flux .. a lot of flux and then with the iron flying over the pads …